Product & Industry

Can the single-component silicone be heated and cured? ENIENT Developed a therm

A brand new single-component silicone that can be cured by heating. The thermosetting silicone takes only 30 minutes to cure without air participation. This technological breakthrough provides more convenient and efficient solutions for users in all industries.

 As an excellent sealing material, silicone is used in a very wide range. Conventional silicone usually requires exposure to the air and takes a long time to fully cure. This thermosetting silicone can not rely on air, but can solidify quickly after just 30 minutes of heating. The research and development of this thermosetting silicone gel has brought greater convenience and efficiency to the electronic assembly industry.

 In addition, this kind of thermosetting silicon gel also has more excellent performance characteristics. It not only has the advantages of general silica gel, but also has higher heat resistance and weather resistance. In high temperature environment, it can maintain stable performance, not easy to aging. At the same time, it can also maintain a long service life in harsh weather conditions. This series of performance characteristics, make the thermosetting silicone in a variety of environments and conditions can perform well, become one of the indispensable materials in the electronics industry.

 Not only that, thermosetting silicone gel also has a high adhesion and sealing. During use, it is able to adhere closely to the surfaces of various materials and form a solid sealing layer. This can not only effectively prevent the infiltration of water vapor, dust and other external substances, but also can provide long-term maintenance and protection, making the electrons more durable.

 In addition, the thermosetting silicone gel also has a high flexibility. After curing, it can maintain good flexibility and expansion, not prone to cracking or deformation. This makes it have a wider applicability in the connection and gap processing of electronic materials, and can better adapt to a variety of complex construction environments and requirements.

 Overall, this EG0508B undoubtedly brings a new solution to the electronics industry. Its unique curing mode and excellent performance can meet the various needs of electronic materials in the process of use, to bring users a more convenient and efficient experience. As an innovative electronic sealing material, thermosetting silicone will become an important choice in the future electronics industry.
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