Recently, with the popularity and increasing demand of electronic products, NTC thermistor is widely used in the field of temperature measurement and control. However, NTC thermistor is susceptible to the external environment during use, leading to instability of resistance value and shortened service life. To solve this problem, high-quality encapsulation technology becomes particularly important.

 One way to improve the quality of NTC thermistor coating is using the ENIENT flexible epoxy protective adhesive EG1160AB series. Flexible epoxy protective adhesive has excellent high temperature resistance, chemical corrosion resistance and impact resistance, and can effectively protect the resistance element from the erosion of the external environment. Moreover, the elasticity and adhesive properties of the flexible epoxy protective adhesive can also improve the mechanical stability and vibration resistance, and prolong the service life of the resistance.

 In practice, in order to achieve high quality NTC thermistor packaging, flexible epoxy protective glue is essential. First, a suitable epoxy resin is selected to ensure a good adhesion and high temperature resistance. Secondly, professional sealing equipment and technology are adopted to ensure that the epoxy protective adhesive can be evenly hung on the surface of the resistance element, and does not produce bubbles and impurities. Finally, the curing time and temperature and humidity conditions of the epoxy protective adhesive are strictly controlled to ensure that the sealed resistance elements can achieve stable electrical and mechanical properties.

 Overall, the high-quality NTC thermistor coating technology is crucial to improve the stability and durability of the resistance. As an effective encapsulation material, flexible epoxy protective adhesive can not only improve the environmental resistance of electrical resistance elements, but also prolong its service life. Therefore, in the production and design of NTC thermistor products, attention should be paid to the optimization of the encapsulation process and the selection of epoxy protective adhesive, so as to ensure the stability and reliability of the product quality and performance.