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EJ0223 Structural Adhesive EPS® SERIES

EJ0223 Epoxy Adhesive EPS® SERIES


EPS® series Part Number EJ0223 Structural Adhesive is 1 part epoxy for bonding , Potting & Rigidizing.


Applications

Electronic Component Bonding, Ruggedizing, Underfill Motors and Transformers
 

 
Details

·         Low temperature curable (80 degree C)
·         110 degree C of glass transition temperature
·         Fast cure at high temperature
·         Heat trigger type cure
·         Requires heat to cure
·         Does not require mixing
 
 
Specifications
 

   
Adhesive Color Before cure = white, After cure = yellow
Adhesive Type 1 Part Epoxy
Application Category Bonding, Potting & Rigidizing
Applications Electronic Component Bonding, Ruggedizing, Underfill Motors and Transformers
Bondline Temperature and Time 120 degree C @ 15 minutes, 80 degree C @ 60 minutes
Elongation 5%
Full Cure Schedule 30 minutes @ 80 Degree C, 10 minutes @ 120 Degree C, 5 minutes @ 140 Degree C
Glass Transition Temperature (Tg) 110 Degree C
Hardness 88 Shore D
Peel Strength 6 piw on Aluminum @ 180 Degree C
Product Series EJ0223
Shear Strength 2,900 psi on Aluminum
Substrates Alloy, Aluminum, Magnet, Metal, SUS
Viscosity 180,000 CPS