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EJ0134 XBOND®

EJ0134 XBOND® is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. EJ0134 XBOND®  is ideal for use in temperatures from 60°F – 110°F.

Non-Sag Viscosity,
High-Strength Bonding Agent


Features & Advantages

 
  • High-strength bonding agent for both existing and new concrete applications
  • Long working time in high temperatures
  • Moisture insensitive allowing installation and curing in damp environments
  • Numerous DOT approvals

Material Properties

 
  • Two component, 100% solids, 1:1 mix ratio epoxy
  • Non-sag, high modulus formula
  • ASTM C881-14 Type I, II, IV & V Grade 3 Class C
  • AASHTO M235
  • 24 month shelf life